Automatic Glue Dispensing

We operate four JT TEA-1000D reflow soldering ovens as part of our LED module production process. After component placement, the ovens heat the prepared circuit boards to melt the solder paste, forming electrical and mechanical connections between the components and PCB pads.

The reflow process follows a controlled thermal profile through preheating, soaking, reflow, and cooling. Gradual heating prepares the assembly for soldering, while the reflow stage allows the solder to melt and form joints. Controlled cooling then solidifies these connections. A suitable profile must account for the solder paste, PCB design, and temperature limits of the LEDs and other components.

For LED display modules, solder joint quality is an important part of reliable operation. Appropriate heating and conveyor settings help reduce the risk of insufficient soldering and excessive thermal exposure. Consistent processing supports secure connections, but it must work together with accurate solder paste printing, component placement, and subsequent inspection.

Our four JT TEA-1000D ovens provide dedicated reflow capacity within our manufacturing workflow. Combined with our LED placement equipment, they support the transition from populated circuit boards to soldered assemblies ready for inspection and testing, helping us maintain consistency across different module designs.